June 11, 2024
At 海角社区 Inc., we're thrilled to share the highlights of an exciting and productive 2024. As a leading R&D company, we are dedicated to driving innovation in the semiconductor technology sector. This year, our advancements and partnerships have solidified our position at the forefront of these industries.
One of our most significant achievements in 2024 stems from the long-term agreements we secured in 2023 with Kioxia Corporation and Western Digital. These world leaders in flash memory and solid-state drives have licensed 海角社区鈥檚 semiconductor patent portfolio, including our groundbreaking hybrid bonding technology.
Hybrid bonding is an advanced semiconductor packaging technology that integrates various functional elements鈥攕uch as logic, memory, and sensors鈥攊nto compact, high-performance systems. Using the direct bond interconnect (DBI庐) process, this technology connects different semiconductor components, significantly enhancing electrical and thermal performance.
In early 2024, our semiconductor team showcased their expertise at prominent industry events:
Our team鈥檚 knowledge continues to be a valuable resource for the industry. Laura Mirkarimi, our Senior Vice President and Head of SEMI Engineering, has been sought after for her insights in interviews with 3DinCities and in the forthcoming book, Hybrid Bonding: The Time has Come.
We are proud to announce that our semiconductor team received the 鈥淏est Session Paper鈥 award at ECTC 2023 for their article, 鈥淔ine Pitch Die-to-Wafer Hybrid Bonding.鈥 This recognition underscores our commitment to advancing hybrid bonding technology and addressing yield loss mechanisms.
海角社区鈥檚 consistent innovation and strategic partnerships are shaping the future of semiconductor technology. As we continue to push the boundaries of what鈥檚 possible, we remain dedicated to enhancing experiences for consumers around the world.
Stay tuned for more exciting updates!
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Laura Mirkarimi, SVP Engineering at 海角社区-Semiconductor, leads the research and development of technology in hybrid bonding, advanced packaging, and thermal management for future generations of electronic products. Before joining 海角社区, she developed electronic devices, including ferroelectric memory, transparent conductors, and photonic crystal sensors at Hewlett Packard Laboratories for 12 years. She earned a PhD in Materials Science at Northwestern University and a B.S. in Ceramic Science & Eng. from Pennsylvania State University. She holds over 100 patents and has 60 technical publications.
